接口-專業
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類別半導體 / 接口IC / 接口-專業
記錄 3,987
頁面 61/133
圖片 |
型號 |
制造商 |
描述 |
庫存 |
數量 |
系列 | 應用程序 | 接口 | 電壓-供電 | 包裝/箱 | 供應商設備包裝 | 安裝類型 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
7,704 |
|
* | - | - | - | - | - | - |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 3.3 V/400M |
2,502 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 5.0 V/400M |
2,700 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
5,040 |
|
RBicLite™ | Sensor Signal Conditioner - Resistive | ZACwire™ One-Wire Interface | 2.7V ~ 30V | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
4,824 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,672 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
2,034 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, SENT, ZACwire™ | 4.75V ~ 5.25V | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
4,374 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, SENT, ZACwire™ | 4.75V ~ 5.25V | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 3.3 V/400M |
6,282 |
|
- | System Basis Chip | CAN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 5.0 V/400M |
6,516 |
|
- | System Basis Chip | CAN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 3.3 V/400M |
5,292 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 5.0 V/400M |
8,370 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
IC SYSTEM BASE W/CAN 48QFN |
2,250 |
|
- | Automotive | SPI Serial | 5.5V ~ 18V | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,474 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
4,176 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
5,040 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
6,696 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, ZACwire™ One-Wire Interface | 4.5V ~ 5.5V | 14-SSOP (0.209", 5.30mm Width) | 14-SSOP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP LIN 2X 3.3 V |
3,780 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIPLIN 2X 5.0 V/ |
8,964 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
5,634 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,672 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
7,560 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,600 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, ZACwire™ One-Wire Interface | 4.5V ~ 5.5V | 14-SSOP (0.209", 5.30mm Width) | 14-SSOP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
6,408 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,114 |
|
* | - | - | - | - | - | - |
|
|
|
NXP |
SYSTEM BASIS CHIP LIN 2X 3.3 V |
4,032 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP LIN 2X 5.0 V |
2,934 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
6,354 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
2,016 |
|
* | - | - | - | - | - | - |
|
|
|
NXP |
IC SWITCH DETECT MULT 32-SOIC |
2,916 |
|
- | Switch Monitoring | SPI Serial | - | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |