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Bourns Introduces New Series of Air Coil Inductors
2023-12
Connectors
Bourns
[十二月 8 2023] A new series of air coil inductors introduced by Bourns features a high Q, a high self-resonant frequency, and a strict inductance tolerance. The AC4842R Air Coil Inductor Series from Bourns provides a low-loss, high-frequency solution that expands the selection of high-Q options available to RF application designers. With an inductance ranging from 22 to 150 nanohenry (nH) and a minimum Q value ...

TSMC Affiliate VIS Is Considering Establishing a Cutting-Edge Chip Plant in Singapore
2023-12
Semiconductors
Taiwan Semiconductor Corporation
[十二月 7 2023] Vanguard International Semiconductor (VIS), a subsidiary of Taiwan Semiconductor Manufacturing Co. (TSMC), is reportedly nearing a decision to build its most advanced semiconductor manufacturing facility in Singapore, according to sources with knowledge of the situation. VIS, a specialty contract chipmaker in which TSMC possesses a 28.3% stake, intends to construct its first 12-inch chip plant in ...

Texas Instruments Begins Construction in Utah on a New 300-mm Wafer Production Facility
2023-12
Semiconductors
Texas Instruments
[十二月 7 2023] In Lehi, Utah, Texas Instruments initiated construction on its 300-mm semiconductor wafer production facility (or “fab”). TI President and Chief Executive Officer Haviv Ilan, accompanied by state and local elected officials, community leaders, and Utah Governor Spencer Cox, witnessed the inaugural stages of construction for the 300-mm wafer fab LFAB2, which will be linked to the organization’s cu ...

Taiwan Semiconductor Launches New ESD Devices Targeting Wearables
2023-12
Semiconductors
Taiwan Semiconductor Corporation
[十二月 6 2023] Taiwan Semiconductor unveils its new TESD Series of single-channel ESD clamping diodes with optimized size and performance for wearable applications. The novel design of the new TESD devices includes bidirectional restraining cells (for ESD protection up to ±30kV) housed in an ultra-compact DFN0603 package. The devices in the new TESD Series are available in versions with 5.0V and 3.3V (maximum) ...

Rohm announces new series of silicon capacitors BTD1RVFL
2023-12
Passive Components
Rohm Semiconductor
[十二月 6 2023] ROHM Semiconductor has announced the new silicon capacitors BTD1RVFL series. Smartphones and wearable devices will progressively incorporate these components. Silicon semiconductor processing technology has been refined over many years, allowing for greater efficacy in a more compact package. Smartphones and other devices with growing functionality require smaller components that support high-den ...

Create efficient, safe and sustainable Spaces - Automate buildings with Wi-Fi HaLow
2023-12
Semiconductors
Acme Electric/Amveco/Actown
[十二月 5 2023] With the rise of the Internet of Things (IoT) and the growing popularity of digital technologies, our reliance on connectivity has grown exponentially. This surge in demand has driven the rapid development of wireless communication technology. The Wi-Fi Alliance issued the Wi-Fi CERTIFIED HaLow certification in November 2021, which is a disruptive innovation in the field. This variant of Wi-Fi, w ...

Infineon introduces a new CoolSiC portfolio in 62 mm packages to help achieve greater efficiency and power density
2023-12
Semiconductors
Infineon Technologies
[十二月 5 2023] Infineon Technologies AG has announced the addition of a new industry-standard package to its CoolSiC 1200 V and 2000 V MOSFET module family. It uses a proven 62 mm device half-bridge topology design and is based on the newly introduced enhanced M1H silicon carbide (SiC) MOSFET technology. The package enables SiC to be used in mid-power class applications above 250 kW, where conventional IGBT sil ...

Infineon introduces the new PSoC Edge product family to bring high-performance, energy-efficient machine learning technology to edge applications
2023-12
Connectors
Infineon Technologies
[十二月 4 2023] Infineon Technologies AG has announced the launch of a new PSoC microcontroller (MCU) product family, the PSoC Edge. The PSoC portfolio is Infineon's high-performance, low-power security device based on the Arm® Cortex® core. PSoC Edge is designed for a new generation of real-time responsive computing and control applications and offers hardware-assisted machine learning (ML) acceleration. The ne ...

Microchip introduces the PIC18-Q24 series of microcontrollers to set a new standard for enhanced code security
2023-12
Connectors
Microchip Technology
[十二月 4 2023] From phones and cars to smart thermostats and home appliances, more and more everyday devices are connected to the cloud. As connectivity increases, it becomes critical to deploy advanced security measures at the chip level to protect firmware and data. In response to current and expanding security threats, Microchip Technology has released the PIC18-Q24 family of microcontrollers (MCUS). In resp ...

Improve transportation and industrial design with low-power 77GHz radar sensors
2023-12
Sensors
Texas Instruments
[十二月 1 2023] Radar sensors in the 77GHz band are commonly used in advanced driver assistance system sensing applications such as blind spot detection and automatic emergency braking, and in level transmitters in industrial tanks. But today, off-highway vehicles, e-bikes, bicycles and parking gates are increasingly demanding proximity and distance sensing. These sensors can help achieve a safer working environ ...

Diodes' low-power 1.8V, 2.5Gbps, dual-data channel ReDriver supports the MIPI D-PHY 1.2 protocol
2023-12
Connectors
Diodes Incorporated
[十二月 1 2023] Diodes introduces a low-power, high-performance signal ReDriver that complies with the MIPI D-PHY 1.2 protocol. The PI2MEQX2503 reconstructs signals transmitted from the camera to the display with data transfer rates of up to 2.5Gbps and is suitable for a variety of product applications such as laptops, tablets, mobile phones, Internet of Things (IoT) devices, commercial displays, augmented reali ...

IAR provides full support for the NXP S32M2 to enhance motor control capabilities
2023-11
Semiconductors
NXP
[十一月 30 2023] IAR, the global leader in embedded development software and services, has now fully supported NXP Semiconductors' new motor control chip S32M2. The S32M2 series is the latest enhanced version of NXP's Arm® Cortex-based S32 vehicle computing platform, featuring high efficiency for body and comfort applications designed to reduce in-car noise and increase passenger comfort. IAR Embedded Workbench f ...