Technology Articles

2024-03 Connectors Infineon Technologies

[三月 26 2024] Infineon Technologies AG has announced the launch of its latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connectivity technology in the Internet of Things and consumer electronics. The module offers a higher price/performance ratio than its peers, enhanced performance by supporting ...

2024-03 Semiconductors NXP

[三月 25 2024] NXP Semiconductors at NVIDIA GTC announced a partnership with NVIDIA to deploy NVIdia-trained AI models into NXP's broad edge processing portfolio through the eIQ machine learning development environment. The integration of the capabilities of the NVIDIA TAO tool Suite with the NXP eIQ machine learning development environment is exciting, enabling developers to accelerate development in the incre ...

2024-03 Sensors Vishay

[三月 25 2024] Vishay Intertechnology has announced the launch of two new IP67-sealed panel potentiometers with built-in knob switches -P16F and PA16F. Vishay Sfernice P16F and PA16F potentiators with dielectric strength up to 5000 VAC and power rating of 1 W at +40 C can be used to simplify industrial and audio application design and optimize cost. The device integrates knobs and panel potentiometers in a sing ...

2024-03 Power Molex

[三月 22 2024] The data center's thirst for energy is enormous and will only increase as the digital world continues to expand. The good news is that uninterruptible power systems (UPS) keep data centers up and running during power outages, ensuring that critical applications continue to run in our connected world. Data centers have become the backbone of our new digital economy. Not only do current technologie ...

2024-03 Power Qualcomm

[三月 22 2024] Qualcomm Technologies announced the launch of the third-generation Snapdragon 8s mobile platform, bringing the most sought-after features of the Snapdragon 8 Series platform to more Android flagship smartphones for an extraordinary top-of-the-line mobile experience. Key features of this new flagship platform include support for powerful end-side generative AI capabilities, always-aware ISP, hyper ...

2024-03 Power Senix Corporation

[三月 21 2024] SiC devices refer to electronic devices made of Silicon Carbide material. Compared to traditional Silicon devices, SiC devices have higher electronic band width, electron saturation drift speed and thermal conductivity, so they perform better in high voltage, high frequency and other applications. SiC devices are widely used in power electronics, including electric vehicles, due to their excellen ...

2024-03 Sensors OmniVision Technologies Inc

[三月 21 2024] OmniVision Technologies, as an internationally renowned image sensor manufacturer, has recently released an epoch-making product - the OV50K40 sensor, whose performance has reached an unprecedented height in several aspects, especially in dynamic range, which is close to the performance of the human eye. This breakthrough technical achievement marks the image sensor technology has entered a new e ...

2024-03 Power Nexperia

[三月 20 2024] Nexperia has announced the launch of an energy balance calculator. This is a powerful networking tool designed to help battery management engineers maximize the battery life of their applications or achieve battery-free applications. The calculator provides engineers with precise data to help them make informed decisions to integrate Nexperia's energy harvesting PMIC into their systems. At the he ...

2024-03 Passive Components Vishay

[三月 20 2024] Vishay Intertechnology announced the launch of a new 80 V symmetrical dual-channel N-channel power MOSFET-- SiZF4800LDT, Combine high-side and low-side TrenchFET Gen IV MOSFETs in a 3.3mm x 3.3mm PowerPAIR 3x3FS monocoque package. Vishay Siliconix SiZF4800LDT is suitable for power conversion in industrial and communications applications, enhancing thermal performance, reducing component count and ...

2024-03 Sensors STMicroelectronics

[三月 19 2024] STMicroelectronics announced the launch of a versatile, direct Time of Flight (dToF)3D LiDAR(Light Detection and Ranging) module with excellent 2.3k resolution, as well as the first order for an ultra-small 500MP indirect Time of Flight (iToF) sensor. Alexandre Balmefrezol, General manager of ST's Imaging Sub-Products division, said: "ToF sensors can accurately measure the distance from the senso ...

2024-03 Connectors Texas Instruments

[三月 19 2024] Texas Instruments has introduced two new lines of power conversion devices that help engineers achieve higher power in a smaller space, delivering ultra-high power density at a lower cost. Texas Instruments' new 100V integrated Gallium nitride (GaN) power stage features heat-enhanced double-sided cooling package technology that simplifies thermal design for medium-voltage applications and enables ...

2024-03 Connectors Infineon Technologies

[三月 18 2024] In today's society highly dependent on electricity, power loss has become a key factor that cannot be ignored in the field of power electronics. In response to industry demand for more efficient and reliable power processing solutions, Infineon Technologies AG has introduced its new silicon Carbide CoolSiC MOSFET G2 trench technology. This technology sets a new standard for power transmission eff ...