Technology Articles
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From Wafer to Package: Full link analysis to improve semiconductor performance
2024-11
Semiconductors
Xilinx
[十一月 12 2024] In today's technology-driven era, the semiconductor industry plays a vital role as the core of information technology and its applications. Every step, from design to manufacturing to packaging, has a profound impact on the performance of the final product. This article will analyze all aspects of the semiconductor industry, and explore how to improve the performance of semiconductor products thr ...
How will AI reshape our lives and manufacturing
2024-11
Semiconductors
4D Systems Pty Ltd
[十一月 12 2024] With the rapid development of science and technology, artificial intelligence (AI) is gradually becoming an indispensable part of our lives. Through automated and intelligent solutions, AI is not only increasing productivity, but also revolutionizing every aspect of an individual's life. This article will delve into how artificial intelligence is reshaping our lives and manufacturing across multi ...
New inrush current limiting PTC thermistor
2024-11
Optoelectronics
Vishay
[十一月 12 2024] Vishay Intertechnology, Inc. has released a new line of inrush current limiting PTC thermistors. Vishay BCcomponents PTCEL High Energy series devices are designed to improve the performance of active charge and discharge circuits for automotive and industrial applications. Combining maximum energy handling capacity to 340J - five times higher than competing devices at high ambient temperatures - ...
The new 512GB device brings higher QLC bit density to UFS
2024-11
Passive Components
Kitronik Ltd.
[十一月 12 2024] KIOXIA Europe GmbH has announced that it has started mass production of the industry's first UFS Ver.4.0 embedded flash memory device with 4-bit/cell QLC technology. QLC UFS offers a higher bit density than traditional TLC UFS, making it ideal for mobile applications that require higher storage capacity. Advances in controller technology and error correction technology have enabled QLC technology ...
New products on geothermal curing, gap pads and dispensable gels
2024-11
Power
Packet Digital LLC
[十一月 11 2024] Parker Hannifin Corporation's chemistry division demonstrated three new thermal interface materials at Electronica 2024. Innovative products on display include new thermal curing, gap pads and dispensable gel products. The company also plans to make a splashy announcement involving the launch of a rapid sampling and prototyping service. With the evolving needs and trends of the electronics indust ...
The core support of automatic driving: complete analysis of drive-by-wire chassis technology
2024-11
Sensors
Matrix Orbital
[十一月 11 2024] In the current wave of revolution in the automobile industry, autonomous driving technology, as a disruptive innovation, has gradually become the target of major automobile manufacturers and technology companies. Accompanied by this trend, is the redefinition and evolution of vehicle chassis technology, in which the chassis by wire technology (Steer-by-Wire, Brake-by-Wire, etc.) as a key support ...
Murata introduces stretchable printed circuits for flexible, customizable and comfortable medical wearables
2024-11
Connectors
Murata
[十一月 11 2024] Murata Manufacturing Co., Ltd. has unveiled an innovative scalable printed circuit (SPC) technology that marks a significant development in printed circuit technology. Its SPC represents the next advance in substrate development, providing flexibility and stretching and deforming capabilities while maintaining full functionality. It is ideal for manufacturing advanced medical products, such as we ...
Breakthrough FIB-SEM technology drives innovation in chip manufacturing
2024-11
Power
Crystek
[十一月 11 2024] In the rapid development of modern science and technology, chip manufacturing has become the core of all walks of life. With the increasing demand for higher performance, smaller size and lower cost, traditional nanomanufacturing technologies are facing new challenges. However, the emergence of the breakthrough focused ion beam scanning electron microscopy (FIB-SEM) technology provides a new idea ...
Pioneers in semiconductor material technology innovation: photoresist and developer
2024-11
Semiconductors
ABLIC
[十一月 9 2024] In the modern electronics industry, the progress of semiconductor technology has greatly promoted the rapid development of information technology, communication, transportation and other fields. In many semiconductor materials, photoresist and developer, as the key materials, play a crucial role. They not only affect the manufacturing process of the chip, but also directly affect the performance ...
Multimodal generative AI drives the demand for memory chips
2024-11
Semiconductors
ABB Embedded Power
[十一月 9 2024] With the continuous progress of technology, artificial intelligence (AI) is penetrating into various fields, especially the rapid development of multimodal generative AI, which has brought new opportunities and challenges to the memory chip market. Multimodal generative AI refers to an AI model that combines multiple data types (such as text, images, audio, etc.) to generate and understand. Its a ...
900V pressure resistance, Toshiba optical relay escort for new energy vehicles
2024-11
Semiconductors
Toshiba Semiconductor and Storage
[十一月 8 2024] In the tide of the global automotive industry's transition to new energy, the innovation and application of power electronics technology has become a key factor in promoting automotive intelligence and electrification. As one of the important components in this process, Toshiba optical relays play an indispensable role in various fields of new energy vehicles with their excellent performance and ...
Enhanced debug analyzer adds RISC-V semi-managed support
2024-11
Power
Seoul Semiconductor Inc.
[十一月 8 2024] SEGGER extends the capabilities of its debugger and performance analyzer Ozone by adding semi-managed support for debugging RISC-V applications. This feature now allows RISC-V developers to use I/O to perform debugging tasks on embedded systems that are directly accessible by the host system without complex hardware setup. Using the host's resources, developers can effortlessly send debug message ...