NXP PMIC-電源管理-專業
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類別半導體 / 電源管理IC / PMIC-電源管理-專業
制造商NXP USA Inc.
記錄 595
頁面 6/20
圖片 |
型號 |
制造商 |
描述 |
庫存 |
數量 |
系列 | 應用程序 | 電流-電源 | 電壓-供電 | 工作溫度 | 安裝類型 | 包裝/箱 | 供應商設備包裝 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP |
IC SYSTEM BASIS CHIP 32LQFP |
4,482 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
3,582 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
5,418 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
7,992 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
8,136 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
LOW-COST ONE-CHIP 5 V QI WIRELES |
3,348 |
|
- | Wireless Power Transmitter | 2mA | 3.4V ~ 5.25V | -20°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) |
|
|
|
NXP |
IC RECEIVER 16KB FLASH 32QFN |
5,778 |
|
- | Wireless Power Receiver | 120mA | 3.5V ~ 20V | -40°C ~ 85°C | Surface Mount | 36-UFBGA, WLCSP | 36-WLCSP (3.07x2.98) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
3,942 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
6,912 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
3,418 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
3,618 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
6,174 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
PF1510 |
6,102 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
2,520 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
5,076 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
6,426 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
6,660 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1510 |
3,582 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
2,988 |
|
Automotive, AEC-Q100 | Automotive | 2.8mA | 2V ~ 28V | -40°C ~ 125°C (TA) | Surface Mount | 48-TQFP Exposed Pad | 48-HTQFP (10x10) |
|
|
|
NXP |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
4,086 |
|
Automotive, AEC-Q100 | Automotive | 2.8mA | 2V ~ 28V | -40°C ~ 125°C (TA) | Surface Mount | 48-TQFP Exposed Pad | 48-HTQFP (10x10) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP 32LQFP |
5,364 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
3,492 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
4,968 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
2,610 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
4,464 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
8,676 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
7,920 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
7,218 |
|
Automotive, AEC-Q100 | Automotive | 2.8mA | 2V ~ 28V | -40°C ~ 125°C (TA) | Surface Mount | 48-TQFP Exposed Pad | 48-HTQFP (10x10) |
|
|
|
NXP |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
8,712 |
|
Automotive, AEC-Q100 | Automotive | 2.8mA | 2V ~ 28V | -40°C ~ 125°C (TA) | Surface Mount | 48-TQFP Exposed Pad | 48-HTQFP (10x10) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
3,420 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |